Direct-to-Chip vs Immersion vs Rear-Door Cooling Compared
Compare the three main liquid cooling approaches for AI and high-density data centers: direct-to-chip cold plates, single-phase and two-phase immersion, and rear-door heat exchangers.
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Three liquid cooling approaches dominate AI and high-density data centers: direct-to-chip cold plates, immersion cooling (single-phase and two-phase), and rear-door heat exchangers. Each has distinct density limits, retrofit characteristics, and operational requirements.